| 摘要 |
<p>The invention relates to a metallic coating, which can be used, for example, for manufacturing electronic components and for interconnecting irreversibly the components into various substrates by employing either low temperature or high temperature solders. It is characteristic for the invention that the coating enables to interconnect electronic components fluxlessly. The invention relates especially to the interconnection technique which is used for example for interconnecting bare chips to the interposer of surface mount package or directly on substrate like printed wiring board or interconnecting surface mount package on printing wiring board. The object of the present invention is in particular the interconnection technique in which the electrolytically deposited solder bumps on electrical contact pads are replaced with self-contained solder balls which make the alloys selection of the bumps more versatile, simpler and cheaper to accomplish. It is in accordance with the present invention to coat solder balls and tin ortin-alloy precoated contact surfaces with the bismuth layer of appropriate thickness. It is also in accordance with the present invention to place bismuth-coated solder particles to contact areas mixed in organic solvent as a paste or as an anisotropically conducted adhesive.</p> |
