ADHESIVE FOR SEMICONDUCTOR COMPONENTS

摘要

An adhesive for semiconductor components, comprising as a substrate polymer at least one cyclic thermoplastic polymer having a number average molecular weight of 1,000 to 500,000 and selected from the group consisting of cyclic olefin polymers (a) and aromatic condensation polymers (b) having repeating units of an aromatic ring in the main chain; an adhesive sheet prepared from the adhesive; a semiconductor component package made by using the adhesive ; and a process for preparing the package.