发明名称 Power MOSFET and fabrication method
摘要 <p>A submicron channel length is achieved in cells having sharp corners, such as square cells, by blunting the comers of the cells. In this way, the three dimensional diffusion effect is minimized, and punch through is avoided. Techniques are discussed for minimizing defects in the shallow junctions used for forming hte short channel, including the use of a thin dry oxide rather than a thicker steam thermal over the body contact area, a field shaping p+ diffusion to enhance breakdown voltage, and TCA gettering. Gate-source leakage is reduced with extrinsic gettering on the poly backside, and intrinsic gettering due to the choice of starting material. &lt;IMAGE&gt; &lt;IMAGE&gt;</p>
申请公布号 EP0890994(A2) 申请公布日期 1999.01.13
申请号 EP19980203152 申请日期 1991.12.19
申请人 SILICONIX INCORPORATED 发明人 HSHIEH, FWU-IUAN;YILMAZ, HAMZA;CHANG, MIKE
分类号 H01L21/265;H01L21/28;H01L21/316;H01L21/322;H01L21/336;H01L21/8234;H01L21/8236;H01L27/088;H01L29/06;H01L29/10;H01L29/51;H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L21/265
代理机构 代理人
主权项
地址