| 发明名称 |
Electronic circuit substrate |
| 摘要 |
An electronic circuit substrate is sealed with a sealing material made of thermoplastic resin having a thermal-expansion coefficient close to that of a ceramic substrate by a compound filler dispersedly mixed in the sealing material. The filler includes at least two of milled fiber, glass fiber, and flaked filler.
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| 申请公布号 |
US5858481(A) |
申请公布日期 |
1999.01.12 |
| 申请号 |
US19970791132 |
申请日期 |
1997.01.30 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
FUKUSHIMA, TETSUO;YOSHIDA, KOICHI;SUETSUGU, KENICHIRO |
| 分类号 |
H01L23/29;H01L23/31;H05K3/28;(IPC1-7):C09K19/00;H01L23/28 |
主分类号 |
H01L23/29 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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