发明名称 Organic solderability preservative compositions
摘要 Known organic solderability preservatives (OSP) contain an azole compound and are applied on a copper surface from an acidic solution. The OSPs are not visible to the naked eye when applied. A number of dyes compatible with the OSP solution and not interfering with solderability has been identified. The composition containing such a dye can produce a layer which is visible to the naked eye when applied even in a thin layer. The suitable dyes contain a cationic imine group having the general formula <IMAGE> where X- is an anion such as chloride, iodide, sulphate, etc., or an organically bonded anionic group such as sulphonate.
申请公布号 US5858074(A) 申请公布日期 1999.01.12
申请号 US19970902198 申请日期 1997.07.29
申请人 NATIONAL RESEARCH COUNCIL OF CANADA 发明人 COLE, KENNETH C.;PELLERIN, ERIC
分类号 B23K35/36;C23F11/10;H05K3/28;(IPC1-7):C23F11/00;C08K5/16 主分类号 B23K35/36
代理机构 代理人
主权项
地址