发明名称
摘要 A water resistant epoxy resin composition is disclosed, said composition comprising an epoxy resin, a compound having at least two phenolic hydroxyl groups sufficient to cure the epoxy resin component, an aromatic nitrogen-containing silane coupling agent and an inorganic filler. The epoxy resin composition is well suited for use as a sealant for electronic components.
申请公布号 JP2843612(B2) 申请公布日期 1999.01.06
申请号 JP19890246203 申请日期 1989.09.21
申请人 TORE DAUKOONINGU SHIRIKOON KK 发明人 ENAMI HIROSHI;IMAI TAKESHI
分类号 C08L63/00;C08G59/00;C08G59/62;C08K5/5435;C08K5/544;C08K5/549;C08K13/02;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08L63/00
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