| 摘要 |
A process of preparing a moisture-resistant fluorine containing SiOx film includes steps of supplying reactant gases containing silicon, oxygen and fluorine into a process chamber and generating plasma in the process chamber, supporting a substrate on a substrate support in the process chamber, depositing a fluorine-containing SiOx film on the substrate by contacting the substrate with the plasma while maintaining temperature of the film above 300 DEG C., and nitriding an exposed surface of the film with a high density plasma. The silicon and fluorine reactants can be supplied by separate gases such as SiH4 and SiF4 or as a single SiF4 gas and the oxygen reactant can be supplied by a pure oxygen gas. The SiH4 and SiF4 can be supplied in a ratio of SiH4/(SiH4+SiF4) of no greater than 0.5. The process can provide a film with a fluorine content of 2 to 12 atomic percent and argon can be included in the plasma to assist in gap filling. The plasma can be a high density plasma produced in an ECR, TCP TM or ICP reactor and the substrate can be a silicon wafer including one or more metal layers over which the fluorine-containing SiOx film is deposited. The substrate support can include a gas passage which supplies a temperature control gas into a space between opposed surfaces of the substrate and the substrate support for maintaining the substrate at a desired temperature. The nitriding step can be carried out in less than 1 minute without applying an rf bias to the substrate. The nitriding gas can be N2, N2O and/or NH3, the nitrogen ion energy can be 20 to 50 eV, the nitrogen flux can be at least 1 mA/cm2 and the nitrogen gas flow rate can be at least 50 sccm. |
