发明名称 |
Semiconductor device having separated exchange means |
摘要 |
The semiconductor device consists of a chip (2) forming an integrated circuit, and a connection substrate (6), with connecting points or balls (10) between the chip and substrate surfaces, distributed in the form of a matrix linked to external connectors (8). The device also incorporates at least one exchanger (14) in two sections (15,16) set at a distance from and facing one another and able to exchange signals in either direction. One of the sections is integrated in the chip and forms a component of its integrated circuit, while the other is carried by the substrate and is linked to the connectors (10). The substrate itself forms part of a wall of a housing containing the chip. |
申请公布号 |
EP0887861(A1) |
申请公布日期 |
1998.12.30 |
申请号 |
EP19980401561 |
申请日期 |
1998.06.25 |
申请人 |
STMICROELECTRONICS S.A.;FRANCE TELECOM |
发明人 |
JAOUEN, HERVE;MARTY, MICHEL |
分类号 |
H01L23/12;H01F17/00;H01L23/64;H01L25/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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