发明名称 Semiconductor device with capacitor and method for fabricating the same
摘要 A semiconductor device includes: a capacitor provided on a supporting substrate having an integrated circuit thereon and including a lower electrode, a dielectric film, and on upper electrode; a first interlayer insulating film provided so as to cover the capacitor; a first interconnect selectively provided on the first interlayer insulating film and electrically connected to the integrated circuit and the capacitor through a first contact hole formed in the first interlayer insulating film; a second interlayer insulating film formed of ozone TEOS and provided so as to cover the first interconnect; a second interconnect selectively provided on the second interlayer insulating film and electrically connected to the first interconnect through a second contact hole formed in the second interlayer insulating film; and a passivation layer provided so as to cover the second interconnect. <IMAGE>
申请公布号 EP0887864(A1) 申请公布日期 1998.12.30
申请号 EP19980111608 申请日期 1998.06.24
申请人 MATSUSHITA ELECTRONICS CORPORATION 发明人 NAGANO, YOSHIHISA;KUTSUNAI, TOSHIE;JUDAI, YUJI;UEMOTO, YASUHIRO;FUJII, EIJI
分类号 H01L21/02;H01L21/768;H01L21/8242;H01L23/522 主分类号 H01L21/02
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