发明名称 SOI SUBSTRATE AND PROCESS FOR PREPARING THE SAME, AND SEMICONDUCTOR DEVICE AND PROCESS FOR PREPARING THE SAME
摘要 In growing a silicon layer on a sapphire substrate to prepare an SOS substrate, or alternatively in depositing an oxide layer or a fluoride layer as an intermediate layer on a silicon substrate followed by the growth of a silicon layer on the intermediate layer to prepare an SOI substrate, heat treatment is carried out in an oxidizing atmosphere after the growth of the silicon layer to oxidize a part of the silicon layer on its surface side followed by the removal of the silicon oxide layer by etching and the residual silicon layer is used as a seed layer to conduct homoepitaxial growth again, or heating is carried out in a hydrogen atmosphere after or in the course of the growth of the silicon layer. This process can provide an SOS substrate or an SOI substrate which is free from defects and has high crystallinity, high orientation and small surface roughness.
申请公布号 CA2294306(A1) 申请公布日期 1998.12.23
申请号 CA19982294306 申请日期 1998.06.19
申请人 ASAHI KASEI KOGYO KABUSHIKI KAISHA 发明人 MORIYASU, YOSHITAKA;MATSUI, MASAHIRO;ISHIDA, MAKOTO;MORISHITA, TAKASHI
分类号 H01L21/20;H01L21/762;H01L21/84;(IPC1-7):H01L21/324;H01L27/12 主分类号 H01L21/20
代理机构 代理人
主权项
地址