Chemical mechanical polishing using two low pH slurries,申请号GB19970026685-传众专利搜索

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发明名称	Chemical mechanical polishing using two low pH slurries
摘要
申请公布号	GB2326523(A)	申请公布日期	1998.12.23
申请号	GB19970026685	申请日期	1997.12.17
申请人	* UNITED MICROELECTRONICS CORPORATION	发明人	SHIH-WEI * SUN;MING-SHENG * YANG;JUAN-YUAN * WU;WATER * LUR
分类号	C09K3/14;H01L21/321;(IPC1-7):H01L21/321	主分类号	C09K3/14
代理机构		代理人
主权项
地址

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