发明名称 Apparatus and method for shaping polishing pads
摘要 <p>Apparatus for shaping a polishing pad (16) includes a pad shaping tool (52) and a fixture (56) for holding the pad shaping tool (52) free of fixed connection to the fixture (56). The pad shaping tool (52) has a pad shaping surface (54) which engages a polishing surface (26) of the polishing pad (16) to shape that surface (26). The pad shaping surface (54) is sized for engaging the polishing surface (26) across it entire width (W). The fixture (56) constrains the tool (52) from movement about the center of rotation (C1) of the polishing pad (16) and constrains the center (C2) of the tool (52) from substantial radial movement with respect to the pad (16). A method for shaping the polishing pad (16) is also disclosed. <IMAGE></p>
申请公布号 SG55295(A1) 申请公布日期 1998.12.21
申请号 SG19970001022 申请日期 1997.04.01
申请人 MEMC ELECTRONIC MATERIALS, INC. 发明人 WALSH, ROBERT, J.
分类号 B24B53/00;B24B53/017;H01L21/304;(IPC1-7):B24B37/04 主分类号 B24B53/00
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