| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a land for mounting parts, which has adhesive force sufficient for mounting parts with faces by providing a non-through connection hole which is not aimed at electrical connection with an inner layer circuit for the land part for parts mounting. SOLUTION: An inner layer circuit 3 is formed on a glass epoxy copper-clad laminated 2 with catalyst, by etching as an inner layer base material. A graplitization is executed and a primer layer, an insulated resin layer 4 and an adhesive layer 5 are formed. The non-through holes reaching the inner layer circuit 3 are pierced into the adhesive layer 5 and the insulated resin layer 4 in the land part for mounting parts with faces by the irradiation with short pulse CO2 laser beams. Then, a through-hole is made through drilling. Then, catalyst is given to the entire face, and plating resin 8 is formed. The surface of the adhesive layer 5 is made rough, and the through connection hole 6, the non-through connection holes 7A and an outer layer circuit 11 are formed by nonelectrolytic copper plating after the surface of the adhesive layer 5 is made rough by the mixed liquid of chrome and sulfuric acid. As a result, the land for mounting parts, which has adhesive force sufficient for mounting the parts with faces, is obtained.</p> |
