发明名称 INTEGRATED CIRCUIT PACKAGES USING TAPERED SPRING CONTACT LEADS FOR DIRECT MOUNTING TO CIRCUIT BOARDS
摘要 An integrated circuit package is provided with a plurality of contact element leads, each lead having a first portion for making electrical connection with the integrated circuit and a second tapered contact portion for mating with a conductive rim of the hole of a circuit board. In conjunction with the integrated circuit package, a fastener is provided for holding the tapered contact elements in mating relationship with the conductive rims. The tapered contact portion of the lead of the integrated circuit package may take any of various forms, as long as the lead is tapered and resilient so that proper mating with a conductive rim can be accomplished. Likewise, the fastener which holds the tapered contact elements in mating relationship with the conductive rims may take any of numerous forms. All that is required is that the fastener couple to both the circuit board and the integrated circuit package, and that the integrated circuit package be removable from the fastener.
申请公布号 EP0583407(B1) 申请公布日期 1998.12.16
申请号 EP19920913232 申请日期 1992.05.08
申请人 GENERAL DATACOMM, INC. 发明人 REYMOND, WELLES, K.
分类号 H01L23/50;H01L23/495;H01R4/48;H01R4/50;H05K1/18;H05K3/32 主分类号 H01L23/50
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