| 发明名称 |
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| 摘要 |
An apparatus has a polishing head for polishing an object such as a semiconductor wafer by using a polishing tape stretched between two guide rollers. The head can be rotated so as to change the angle of contact between the tape and the object and also undergo a reciprocating motion perpendicular to the direction of supply of the tape. For this purpose, the apparatus includes a first plate attached to the head and a second plate supported parallel to each other and in motion-communicating relationship by means of rods which are attached to the first plate and penetrate the second plate. The second plate is attached to the rotary shaft of a direct drive motor for causing oscillatory angular motion. This rotary shaft is tubular and an inner shaft for causing the oscillatory motion passes slidably therethrough. |
| 申请公布号 |
JP2837342(B2) |
申请公布日期 |
1998.12.16 |
| 申请号 |
JP19930341224 |
申请日期 |
1993.12.13 |
| 申请人 |
NIPPON MIKURO KOOTEINGU KK |
发明人 |
MORIOKA IZURU;YUI MAREYOSHI |
| 分类号 |
B24B9/00;B24B9/06;B24B21/00;B24B35/00;(IPC1-7):B24B21/00 |
主分类号 |
B24B9/00 |
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