| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a case capacity by forming a weight plate and a single- surface substrate while their rear surfaces are joined to each other, placing a detection element on the packaging surface of and the opposite surface of a single-surface substrate, and electrically connecting the single-surface substrate and the detection element. SOLUTION: A weight plate 2 consisting of a metal plate is placed on the inner surface of a case 1 that is made of resin via a rubber leg 3. A single- surface substrate 4 is mounted on the upper-surface side of the plate 2 and further a detection element 5 for detecting an angular velocity is mounted to the lower surface side of the plate 2. In this substrate 4, various kinds of electronic components are mounted only at the opposite side of the plate 2 and the largest semiconductor element 6 among them is mounted at the central part of the upper surface of the plate 2. In this state, a cut-out is provided at the plate 2 in the element 5 and the substrate 4, a pin is erected at the substrate 4 corresponding to the cut-out, and a wire that is connected to a detection element is wound around the tip of the pin, thus achieving an electrical connection to the element 5. |
