| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer pre-alignment device which can correctly pre-align a wafer regardless of the material of the wafer. SOLUTION: A roller 20 is pressed on the outer periphery of a wafer W to rotate the wafer by one revolution. Since the roller 20 is displaced most at the center of the orientation flat of the wafer W, the position of the orientation flat is found from the displacement of the roller 20. The wafer W is pre- aligned by rotating the wafer W based on the found position, such that the orientation flat is positioned in a predetermined direction.</p> |
