| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for loading a semiconductor component in a simple structure and a semiconductor device using the substrate with a small number of processes. SOLUTION: A wiring pattern 2, including a pad part 3 to be electrically connected with an electrode 9 of a semiconductor component 8 and a land part 5 for forming an outside connecting terminal 10 in a pattern, is formed on an insulating film 1, and a heating adhesive anisotropic conductive adhesive layer 7 is integrally layered, so that the wiring pattern 2 can be covered. Thus, a substrate for loading a semiconductor component can be constituted. The semiconductor component 8 is loaded on the anisotropic conductive adhesive layer 7 for the substrate for mounting the semiconductor element and heated and pressured, so that they can both be bonded integrally, and the pad part 3 of the wiring pattern 2 is electrically connected through the anisotropic conductive adhesive layer 7 with the electrode 9 of the semiconductor component 8. Thus, a semiconductor device is constituted. |
