发明名称 |
METHOD AND APPARATUS FOR PRODUCING A UNIFORM DENSITY PLASMA ABOVE A SUBSTRATE |
摘要 |
An apparatus and method for processing a substrate in the presence of a plasma, the apparatus including: a chamber enclosing a region maintained at a low pressure; a substrate support disposed in the region and having a substantially horizontal substrate support surface for supporting a substrate; and a coil disposed in the chamber and for producing a radio frequency field within the chamber to create an ionizing plasma above the substrate support surface, the coil being disposed for maintaining a plasma having equipotential lines which extend substantially parallel to the upper surface of the substrate across substantially the entire upper surface of the substrate.
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申请公布号 |
WO9852208(A1) |
申请公布日期 |
1998.11.19 |
申请号 |
WO1998US09739 |
申请日期 |
1998.05.13 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TANAKA, YOICHIRO;HONG, LIUBO;WADA, YUICHI |
分类号 |
H05H1/46;H01J37/32;H01L21/203;(IPC1-7):H01J37/32 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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