发明名称 |
Methods of fabricating dendritic powder materials for high conductivity paste applications |
摘要 |
Methods for forming pastes of dendrites particles coated with an electrically conductive coating are described. A surface is placed in contact with an electrolytic or electroless plating solution. Dendrites are formed on the surface. The dendrites are exposed to another plating solution to plate a coating on the surface of the dendrites. The coated dendrites are removed from the surface to form a powder of coated dendrites. The powder is added to a polymer material to form a paste which is heated to fuse the dendrite surfaces to form a network of interconnected dendrites and further heated to cure the polymer. When the paste is disposed between adjacent electrically conductive surfaces, the coated dendrites fuse to the electrically conductive surface to form electrical interconnections.
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申请公布号 |
US5837119(A) |
申请公布日期 |
1998.11.17 |
申请号 |
US19960689553 |
申请日期 |
1996.08.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KANG, SUNG KWON;PURUSHOTHAMAN, SAMPATH;WALKER, GEORGE FREDERICK |
分类号 |
C25C5/02;C25D5/16;C25D5/48;H05K3/32;(IPC1-7):C25C5/02 |
主分类号 |
C25C5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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