| 摘要 |
PROBLEM TO BE SOLVED: To provide the laser processing apparatus which enables to form a high precision pattern such as scribed groove and the like, and yet to prevent short-circuiting due to recrystallization of once vaporized thin film material. SOLUTION: The laser processing apparatus 1 is an apparatus for forming a pattern on a face 9a of a laminated layer to be treated, which is one face of pliable transparent and insulated base plate 9, by irradiating the laser light L to the layer 9a. The apparatus is provided with a stage 2 of transparent material with a convex curved face 2a and a laser head LH on the reverse side 2b of the stage 2. The laser and light L irradiates to the layer to be treated from the laser head LH and through the stage 2 and the transparent insulated plate 9, while the convex face 2a of the stage 2 is being touched to the other face 9b of the transparent insulated plate 9. |
