发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD BY USING THE SAME AND METHOD OF MANUFACTURE OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition capable of developing with an alkaline solution, high in sensitivity and capable of increasing film thickness. SOLUTION: This positive photosensitive resin composition contains a material generating an acid by light and a polymer in which the concentration of carboxy groups is <=2.6 mmol/g and having sulfo groups represented by the formula in which each of R<1> , R<2> , R<3> is a 6-50C alkyl, aryl, aralkyl or heterocyclic group optionally in which an O or S atom, methylene, amine, carbonyl, sulfon, ester, sulfon ester, amido, urea, carbonate or carbamate, a polyvalent bonding group can be contained except an imido or a sidechain alkoxycarbonyl group respectively, at least one of them has a sulfo group and (x) representing a structural ratio of repeating units is 5-100 mol.%.
申请公布号 JPH10307394(A) 申请公布日期 1998.11.17
申请号 JP19970118980 申请日期 1997.05.09
申请人 HITACHI LTD;HITACHI CHEM CO LTD 发明人 MAEKAWA YASUNARI;MIWA TAKAO;UENO TAKUMI;OKABE YOSHIAKI
分类号 G03F7/022;G03F7/027;G03F7/037;G03F7/039;G03F7/40;H01L21/027;H01L21/312;(IPC1-7):G03F7/039 主分类号 G03F7/022
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