发明名称 Grounding clip for shielded modular connector
摘要 A shortened ground path for the shield of a shielded modular connector (e.g., RJ-45, etc.) mounted against a bracket that is to be seated against a slot in a chassis is provided by a metallic grounding clip that slips over the bracket. The clip has edges that have been folded to slidably engage the bracket, and an orifice shaped to match the opening of the modular jack, so that the modular plug may pass through that orifice as it mates with the jack. The clip also has two opposing curved metal contacts along the perimeter of the orifice that engage and bear against the exposed shield portion of the modular plug as it mates with the modular jack. A pair of metal tabs engage the opening of the modular jack to align, or register, the orifice in the clip with the opening of the jack, and prevent the clip from easily sliding along the bracket once registration has been achieved. Since the grounding clip is as wide as the bracket, when the circuit assembly (I/O board) having the bracket is installed in the chassis the clip contacts the chassis directly, just as the bracket does. But the clip is also in direct contact with the shield of the modular plug whenever it is connected to the jack. Thus the grounding clip provides a direct path from the shield on the modular plug to the chassis.
申请公布号 US5838550(A) 申请公布日期 1998.11.17
申请号 US19970919461 申请日期 1997.08.28
申请人 HEWLETT-PACKARD COMPANY 发明人 MORRIS, TERREL L.;PETERSON, ERIC C.;METCALF, JEFFREY N.
分类号 H01R13/658;H01R13/74;(IPC1-7):H05K9/00 主分类号 H01R13/658
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