| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wire bonding method to perform excellent wire bonding immediately after restart of working, even if a stand-by period has been long. SOLUTION: A small ball 6a is formed by generating electrical spark between the lower end of a wire 6, inserted through a capillary tool 21, and a torch 30. Then, a large ball 6b is formed by generating electrical spark again, and pressed by the lower surface of the capillary tool 21 against a pad 4 on a chip 2, thus performing bonding. As the large ball 6b is soft, it is sufficiently crushed by the lower surface of the capillary tool 21 and is firmly bonded to the pad 4.</p> |
