| 摘要 |
PROBLEM TO BE SOLVED: To ensure wire bonding even to pads projected from a lower chip by performing a wire bonding process twice. SOLUTION: A first semiconductor chip 10 is fixed onto an island 13, and a second semiconductor chip 11 is fixed onto the first semiconductor chip 10. The second semiconductor chip 11 has a projection portion 20 projected from the first semiconductor chip 10. A first heating stage performs wire bonding on main portion. Then, a second heating stage 25 performs wire bonding on bonding pads 12a on the projection portion 20. |
