| 摘要 |
PROBLEM TO BE SOLVED: To drop power impedance and to improve electric noise. SOLUTION: Plural signal pads 4, plural power pads 7 and plural ground pads 9 are provided for the active face of a semiconductor chip 1. A device hole 5 from which an insulating material is removed is provided for a flexible insulating board 2. A power conductor pattern 6 and a ground conductor pattern 8 are formed by making them astride the device hole 5. Connection branchings 601 and 801 narrower than the power pads 7 and the ground pads 9 are provided for the power conductor pattern 6 and the ground conductor pattern 8. |
