| 摘要 |
The device is used for positioning semiconductor chips (10) on a printed circuit board (5), by picking up each chip from an initial location (A) and pivoting it sidewards to a second location (B), using a manipulator (1) with a chip gripper (2). A camera is provided at the first location for determining the position of the semiconductor chip, with a sensor or a second camera at the second location for determining the position of the printed circuit board, for controlling a position correction device (9) for the manipulator. |
