| 摘要 |
PURPOSE: To accurately grasp the state of every processing apparatus by a method wherein flaws which have been detected by an outward-appearance inspection apparatus are sorted automatically at every processing apparatus, flaws on a wafer are pursued and the vitality of the flaws is discriminated. CONSTITUTION: A circuit pattern on a wafer 1 which has been illuminated with an Xe lamp 12 is magnified and detected by a TV camera via an objective lens 3, it is A/D-converted 14, it is compared with an image which has been stored in an image memory 15a and which immediately precedes, and a flaw is detected. That is to say, a detected image is aligned with the stored image by an alignment circuit 16, a difference image is detected by a difference image detection circuit 17, a binarized image is obtained by a binarization circuit 18, and, e.g., a disconnection is specified as the flaw by a CPU 31. When the flaw is detected, an inspection is suspended, the wafer 1 is moved by a Z-control circuit 19, multiple-focus images in a flaw part and a corresponding good-product part are detected by the same means, their difference image and a maximum value are found, the flaws are sorted by a flaw sorting circuit 30, and their vitality degree is discriminated. Thereby, the state of every processing apparatus is grasped so as to contribute to the enhancement of a yield. |
