| 摘要 |
PROBLEM TO BE SOLVED: To stably use an adsorptive member of a vacuum chucking device for long time and improve an yield in a semiconductor polishing process. SOLUTION: This device comprises a vacuum chuck 15 for adsorbing a workpiece (semiconductor wafer) 3 utilizing negative pressure through an adsorptive member 21, which is porous, has air permeability and is formed into a disk, provided. In this case, the thickness of the adsorptive member 21 can be made substantially thin than the thickness (10 mm-20 mm) of a conventional adsorptive member by setting its thickness to 2 mm-8 mm. This can prevent abrasives 4 containing abrasive grains and powder products from retaining in the adsorptive member 21 for a long time, as a result the adsorptive member 21 becomes hard to occur loading, which provides stable use for a long time. |
