| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to inspect an erroneous wire-bonding wiring on an IC chip accurately and rapidly by an image processing by a method wherein data on the position of a bonding point on a pad, data on the positions of wires, data on the positions of leads and data on the coordinate of a CAD, which is made out in the design of the IC chip, are used. SOLUTION: An IC chip is illuminated by an LED coaxial illuminator 5, an LED diffusion illuminator 6 and an LED transparent illuminator 7 and the chip is imaged by a CCD camera 8 from the surface thereof to make out data d1 on a bonding position on a pad, data d2 on the positions of wires and data d3 on the positions of leads 3. In an image processing unit 9; the data d1, the data d2 and the data d3 are led into the unit 9 and an erroneous wire-bonding wiring on the chip is inspected by an image processing using data d4 on the coordinate of a CAD, which is made out previously in the design of the chip, as reference data. |
