| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a multi-chip mounting method which is effective in mounting chips of different height on each side of a board and capable of coping with repairs by a method wherein chips are mounted on the surfaces of two boards respectively, and then the boards are bonded together interposing adhesive agent between the rears of them. SOLUTION: An adhesive layer 10 is interposed between boards 8 and 9 both mounted with chips, and it is preferable that the boards 8 and 9 are bonded together at a bonding temperature lower than the glass transition temperature of adhesive agent which serves as chip mounting material. The boards 8 and 9 can be bonded together through such a method where buffer layers or rubber rolls are used or a method where a hydrostatic pressure is used. Chips can be connected to the boards in a board bonding process where adhesive agent is not cured yet or a curing reaction is not sufficient yet, and the curing reaction of adhesive agent 3 and the adhesive layer 10 can be made to start at the same time. In this case, this mounting method is effective for repairs or in shortening a manufacturing process in time. By this setup, chips of different height can be effectively mounted on each side of a board.</p> |
