| 摘要 |
PROBLEM TO BE SOLVED: To faciliate the manufacture of a carrier tape and reliably prevent outer leads from being bent. SOLUTION: This carrier tape 10 has a carrier tape main body 11 in which a plurality of pockets 14 for containing a semiconductor integrated circuit device (QFP.IC 1) having a plurality of outer leads 3 projected from each of four sides faces of a resin-sealed body 2 are formed and adjacently arrayed with a connection 15 held between the adjacent pockets 14. In this carrier tape 10, guides 16 for engaging with corner portions of the resin-sealed body 2 of the QFP.IC 1 are formed at corner portions of the pocket 14 of the carrier tape main body 11. Accordingly, even in the case where a great shock is given by any chance to the carrier tape 10 in a packed state due to dropping, the collision of the outer leads against side faces of the pocket 14 can be avoided because the corner portions of the resin-sealed body of the QFP.IC 1 are positionally regulated by the guides of the pocket and, as a result, the outer leads of the QFP.IC 1 can be prevented from being damaged. |
