| 摘要 |
PROBLEM TO BE SOLVED: To prevent electromagnetic waves from being leaked to the outside from an enclosure for an electronic apparatus by a method wherein a heat-dissipating member which is composed of a material of good thermal conductivity is bonded directly to the surface of a shielding material at the enclosure, for the electronic apparatus, which is formed in such a way that the shielding material is transferred integrally to the inner circumferential face of the enclosure composed of a resin material. SOLUTION: An enclosure 13 for an electronic apparatus is constituted of a thermoplastic resin material 3, and it is formed in a box shape by an injection molding means. A shielding material 2 which is formed in a foil shape or a sheet shape by a conductive material such as copper or a copper alloy is transferred integrally, by an in-mold transfer operation, to the inner circumferential face of the enclosure 13, for the electronic apparatus, which is formed to be box-shaped. Then, a heat-dissipating member 1 which is formed in a sheet shape by a material of good thermal conductivity such as copper, a copper alloy, aluminum or the like is bonded directly to the surface of a part of the shielding material 2. Thereby, it is possible to prevent electromagnetic waves from being leaked to the outside from the enclosure 13 for the electronic apparatus, and it is possible to diffuse heat generated inside the enclosure 13. |
