| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a collectively laminated ceramic wiring board which can increase the wiring density and can reduce the wiring resistance by forming the insulator of a multilayered ceramic wiring board of a heat-resistance thin plate and forming the wiring pattern to the surface of the green sheet on through holes and recessed sections on the surfaces of the thin plates, and then, laminating the thin plates upon another and electrically connecting the upper and lower through holes to each other. SOLUTION: After a dry film is press-fixed to the rear surface of alkali-free glass 2 and a protective film is stripped off, and then, a positive film having a prescribed pattern is set, exposed, and developed, a resist film is formed in a prescribed pattern. Then holes and grooves 3 for wiring are simultaneously formed by working the resist-side of the glass 2 with a sand blast. The holes are formed on the front surface side of the glass 2 at the same locations as those of the holes formed on the resist-film side of the glass 2 in the same procedure and through holes 4 are formed by working both surfaces of the glass 2. After the holes 4 and grooves 3 are filled up with Ag/Pd paste 5, connecting pads are formed by printing the same kind of paste. Fifty pieces of glass 2 are laminated upon another so that the positional deviations among the holes 4 may become the minimum and the laminated body is sintered. When a collectively laminated ceramic wiring board is formed in such a way, the wiring density of the board can be increased and the wiring resistance of the board can be reduced.</p> |
