| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress the influences upon a wire bonding process, such as breakages of bonding decline in bondability between a bonding wire and an inner lead, etc., by a method, wherein easy-to-deform parts which are easier to deform than the other parts of inner lead tip parts are formed in downset parts. SOLUTION: A neck 21 in the width direction of an inner lead 1 is formed in the downset part 10 of the inner lead 1 for making the deforming force of the downset part 10 smaller than that of the other part. Therefore, when downset depths are relatively large, even if a semiconductor chip 5 is pressed against a jig 4 and a force which pushes up the downset parts 10 of the inner leads 1 to produce an inclination tends to be applied, the necks 21 which are formed in the downset parts 10 of the inner leads 1 in the width direction of the inner lead 1 are deformed and absorb a force pushing up the downset parts 10 in a thickenss direction to make an inclination. With this constitution, the inclination of the bonding plane 11 of the inner lead 1 can be suppressed.</p> |
