发明名称 METHOD FOR MEASURING ADHESION STRENGTH OF COVERING ON CERAMIC MOLDING
摘要 PROBLEM TO BE SOLVED: To measure the adhesion strength of, for example, an electrode and a strip conductor on a ceramic molding and to monitor quality by loading the covered ceramic molding into a dipping bath, performing heat treatment, and then evaluating the damage of a covering. SOLUTION: A covered ceramic molding is loaded into a dipping bath and is exposed to a temperature of at least 700 deg.C for heat treatment. In that case, the adhesion strength of the covering is evaluated by inspecting the release of, for example, an electrode, a strip conductor, and a protection layer. In the dipping bath, a dense proton acid that is selected from a group of HCl, H3 PO4 , H2 PO3 , H3 PO2 , H2 SO4 , H2 SO3 , and HNO3 is used. A chemical load due to an exhaust gas constituent can be easily and efficiently simulated by using the acids. Also, a stagnation time in the dipping bath is set to at least one hour, thus simulating the continuation operation of sonde nucleus of, for example, lambda sonde.
申请公布号 JPH10282048(A) 申请公布日期 1998.10.23
申请号 JP19980065586 申请日期 1998.03.16
申请人 ROBERT BOSCH GMBH 发明人 NEES SIEGFRIED;NEUMANN HARALD;STANGLMEIER FRANK DR
分类号 G01N27/409;G01N17/00;G01N19/04;G01N27/26 主分类号 G01N27/409
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