| 摘要 |
PURPOSE:To provide a method of forming leads of high quality, where the leads of a semiconductor device can be accurately formed high in productivity by adequately controlling a lead forming die in clamping force. CONSTITUTION:A primary motor 18 is provided to move an upper platen 8 vertically, furthermore an auxiliary power motor 25 is mounted on the upside of an upper platen 8, a punch 13 is built in freely retractable manner in the main body 10 of a lead forming die 110 fixed to the upper platen 8, and the punch 13 is pressed by a punch pressing ball screw 26 rotated by the auxiliary power motor 25 against a die 14 of a lead forming lower die 112. |
