| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device and a method for manufacturing the same wherein the device is made thin by employing an LED chip whose thickness is reduced by either rendering a substrate for laminating a semiconductor considerably thin or designing the chip as not using any substrate. SOLUTION: This device comprises an emission element chip 30 which has a lamination of semiconductor layers 3, 4 and 5 to form an emission layer and the emission element chip 30 is so formed as to have a thickness of not larger than 50 μm along the direction of lamination of the semiconductor layers. In the case where a chip-type light-emitting device is manufactured, the device is constituted of an insulating substrate 31 which is provided with terminal electrodes 32 and 33 at both ends thereof, the emission element chip 30 which is mounted on the insulating substrate 31 with one of electrodes (an n-side electrode 9) formed thereon being electrically connected to one terminal electrode 32, a wire 34 for electrically connecting the other electrode (a p-side electrode 8) on the emission element chip 30 to the other terminal electrode 33, and a resin package 35 for covering the emission element chip 30. |
