LAMINATE MATERIAL AND CHIP CARRIER USING IT

摘要

PROBLEM TO BE SOLVED: To realize satisfactory adhesive properties between an insulating layer and a conductor layer even when the insulating layer of a chip carrier containing the insulating layer and the conductor layer formed on the insulating layer is formed of BCB resin. SOLUTION: In the chip carrier having a structure that a conductor layer is formed on an insulating layer, the insulating layer is formed in a structure that SiO2 filler is dispersed in benzocyclobutene resin, and a surface of the insulating layer in contact with the conductor layer is treated with permanganate. And, a content ratio of the filler to 100 pts.wt. of the resin of the insulating layer is preferably 1 to 15 pts.wt, and a particle size of the filler is preferably 5μm or less.