Method for fabricating a heat sink-integrated semiconductor package

摘要

A heat sink-integrated semiconductor package is fabricated by a characteristic method comprising the steps of dispensing a liquid epoxy resin over at least the bare surface of a heat sink mounted with a semiconductor chip, curing said dispensed liquid epoxy resin to form a first encapsulating part so as to prevent delamination at the interface between said heat sink and said semiconductor chip, molding a mold compound to form a second encapsulating part to protect said package from the external environment. The semiconductor package of the present invention, the first encapsulating part is of stronger bonding strength than the second encapsulating part, so that the delamination phenomenon at the interface between heat sink and semiconductor chip can be prevented or relieved efficiently.