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发明名称
SOLDER BUMP MOUNTING METHOD
摘要
申请公布号
JPH10247670(A)
申请公布日期
1998.09.14
申请号
JP19970065497
申请日期
1997.03.03
申请人
RICOH CO LTD
发明人
SAKATSU TSUTOMU
分类号
H01L21/60;H01L21/603;H05K3/34;(IPC1-7):H01L21/603
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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