| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable probe tests of wafers including plural kinds of integrated circuits to be carried out through a series of probe test processes without an interruption and the necessity of re-setting by providing recognition circuits for the probe tests and pads for measuring the recognition circuits in correspondence with the kinds of integrated circuits, in the integrated circuits additionally. SOLUTION: ICs A-D are composed of recognition circuit measuring pads 2 (2a-2d) and IC measuring pads 3 (3a-3d). A probe test is carried out according to measurement programs corresponding to the kinds of ICs by use of the pads 3a-3d after the kinds of the ICs through the measurement of resistance values R of the circuits 1a-1d by use of the pads 2a-2d. The process is repeated thereby enabling the probe test over the whole wafer to be performed at a time. Even if there are differences between the configurations of circuits and between the wirings of aluminum depending on the kinds of the circuits, an easy determination is made possible with the addition of recognition circuits.</p> |
