| 摘要 |
PROBLEM TO BE SOLVED: To improve the connection reliability and reduce the manufacturing time by laying a sheet-like setting resin on a substrate, bonding a semiconductor device to connection terminals with the resin sandwiched, and at the same time sealing the device on the substrate with the resin. SOLUTION: A sheet-like unhardened underfill thermosetting resin 9 is prepared in a solid or half-solid state according to the shapes of a semiconductor chip 1 and interconnecting terminals 2 and thickness of these terminals 2 and can be easily mounted on a substrate (interpose) 3. This resin 9 is heat-cured into a perfect and tight solid state underfill resin 8 which adheres and seals the chip 1 to interposer 3. Thus it is possible to perfectly prevent unfilled parts or inner voids from occurring. |
