| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in productivity, in which a plurality of LED chips are mounted on a board. SOLUTION: This semiconductor device is provided with a plurality of LED chips 1 and a three-dimensional forming board 3 on which a plurality of recessed parts 31 accommodating the respective LED chips 1 are formed. Wiring patterns 4 are formed from two facing side walls 34 of the recessed parts 31 to the whole upper surfaces. Surfaces which are not electrodes 11, 12 surfaces of the LED chips 1 become bottom surface 32 sides of the recessed parts 31. The LED chips 1 are so mounted that the electrodes 11, 12 surfaces face the wiring patterns 4 formed on the side walls 34. Spaces between the electrodes 11, 12 surfaces of the adjacent LED chips 1 are connected by using solders 5 and the above wiring patterns 4. |
