发明名称 |
Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module |
摘要 |
A method for fabricating a metal interconnection pattern for an integrated circuit module is provided comprising the steps of: aligning only one face of the module, forming a metal layer on at least one other face of the module, applying a coating of photoresist to the metal layer, exposing predetermined portions of the photoresist to reflected radiation, and shaping the metal layer in accordance with the exposed photoresist portions. <IMAGE> |
申请公布号 |
EP0593199(B1) |
申请公布日期 |
1998.09.09 |
申请号 |
EP19930307937 |
申请日期 |
1993.10.06 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
BALCH, ERNEST WAYNE;WEAVER, JR., STANTON EARL;KING, WILLIAM HAROLD;GOROWITZ, BERNARD |
分类号 |
H01L21/60;H01L21/48;H01L23/12;H01L23/498;H05K3/00;H05K3/06;H05K3/34;H05K3/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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