| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject material having both stress-reducing properties giving durability to thermal stress and reworkability by incorporating an epoxy resin in a liquid state at normal temperature, which contains a specific epoxy resin in a specific content, with a curing agent and an inorganic filler. SOLUTION: This material is obtained by containing (A) an epoxy resin in a liquid state at normal temperature with pref. a viscosity of <=500PA.s at 25 deg.C which includes 5-30wt.% of an epoxy resin of formula I [(n)=4(m)+1; (m) is an integer of >=0; R1 is a group of formula II or formula III] based on the whole epoxy resins and in which the epoxy resin of the formula I [(m)>=1] is included in the content range of 10-60wt.% based on the whole epoxy resins of the formula I, (B) a curing agent (e.g. bisphenol A) and (C) a spherical inorganic filler (pref. silica with an average diameter of <=10μm and the maximum diameter of <=30μm, etc.). It is possible to remarkably increase both reworkability and reliability of a flip chip mounting-type semiconductor using an organic printed wiring board by applying the resultant material.
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