| 摘要 |
PROBLEM TO BE SOLVED: To prevent an false inspection by connection failure by pressing an integrated circuit inspected to be provided with an inspection electro-conductive tape disposing minute electro-conductive wires by a fine pitch on the inspection electro-conductive tape so as to cover a number of terminal parts of a board for a sensor. SOLUTION: With regard to the inspection electro-conductive tape body of an inspection electro-conductive tape 11, a number of minute electro-conductive wires of about 100μm or less are fixed by a minute pitch of about 15-500μm so that both the ends are positioned on the upper and lower faces of the sheet material of thickness of about 2mm or thinner. The manipulator 21 of the feeder 18 of an integrated circuit 2 such as LSI and IC is actuated, and the integrated circuit 2 transported by a transportation conveyor 19 is sucked by a suction arm 20, raised and rotated. The terminal of a board 1 for a sensor and the terminal 3 of the sucked integrated circuit 2 are brought into contact with a plurality of the minute electro-conductive wires of the inspection electro-conductive tape 11 respectively, and pushed so that the minute electro-conductive wires are slightly flexible. In this state, an inspection machine 8 is actuated, and the good or inferior product of the integrated circuit 2 is checked.
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