SEMICONDUCTOR POWER DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the resistance of a semiconductor power device by constituting a frame of connecting sections connected to at least one of one or more bumps for connecting semiconductor areas of the device to the outside. SOLUTION: A frame comprises a plurality of first connecting sections 16 which are connected to drain metallic conductors 4 through each bump 8 and a plurality of second connecting sections 18 which are connected to source metallic conductors 6 through each bump 8. The first and second connecting sections 16 and 18 connect the drain and source semiconductor areas of a semiconductor power device to the outside, respectively. The specific number and arrangement of the connecting sections of the frame vary depending upon the number of conductors 4 and 6 and the number and spatial arrangement of the bumps 8 on the conductors 4 and 6. Since the resistance of the final metallic interconnection can be reduced by utilizing the bumps 8 distributed along the conductors 4 and 6 on the semiconductor areas, the Rdson of the power device can be reduced.