发明名称 GLASS RESIN BOARD
摘要 PROBLEM TO BE SOLVED: To enable a glass resin board to be improved in processing uniformity and precisely processed, by a method wherein a glass resin board is formed of glass fiber impregnated with resin, and a temperature difference between the melting points of glass fiber and resin is specified. SOLUTION: A glass resin board 6 is formed of glass fiber 61 impregnated with resin 62. When a temperature difference between the melting points of glass fiber 61 and resin 62 is set smaller than 650 deg.C, a thermal processing rate difference between the glass fiber 61 and the resin 62 becomes small, so that the glass resin board 6 can be uniformly processed, and the glass resin board 6 is optimal for precise processing. For instance, the melting point of the glass fiber 61 is 840 deg.C. The melting point of the resin 62 is 200 deg.C. The resin 62 is composed of 20wt.% of epoxy resin and 20wt.% of bismaleymid triazine resin. The glass resin board 6 is as thick as 100μm.
申请公布号 JPH10229257(A) 申请公布日期 1998.08.25
申请号 JP19970047249 申请日期 1997.02.13
申请人 IBIDEN CO LTD 发明人 TSUKADA KIYOTAKA;MINOURA HISASHI
分类号 H05K1/03;(IPC1-7):H05K1/03 主分类号 H05K1/03
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