| 摘要 |
PROBLEM TO BE SOLVED: To reduce the stress exerted on TAB connections, by making leads on a substrate longer by specified length than leads on an IC. SOLUTION: A semiconductor element 11 is connected to a substrate 13 through adhesives 12. On the substrate 13 a substrate 14 is connected. On the element 11 electrically connecting bump electrodes 15 are formed as well as protrudent electrodes 16 on the substrate 14 and electrically connected to the electrodes 16 by the tape automated bonding(TAB) composed of a signal layer 17 and polyimide substrate 18. A signal layer of the element 11 has a length L1 and that of the substrate 14 has a length L2 so that L1<L2 and L1:L2=1:1.3, this reducing the strain of the connection by 22% at the substrate. If L2/L1 is over 1.3, the strain of the connection can be greatly reduced. |
